Microarchitecture Tailored to 3D-Stacked Near-Memory Processing LLM Decoding (U. of Edinburg, Peking U., Cambridge et al.)
A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design,” was published by researchers at University of Edinburgh, Peking University, University of Cambridge, University of Chinese Academy of Sciences, and the Hong Kong Un
ORIGINAL SOURCE →via Semiconductor Engineering
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